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  multilayer ceramic chip capacitors 1 of 3 creation date : november 20, 2017 (gmt) CGA5L1X7R0J226M160AE tdk item description cga5l1x7r0j226mt***s applications automotive grade feature soft soft termination aec-q200 aec-q200 series cga5(3216) [eia 1206] status production size length(l) 3.20mm +0.40,-0.20mm width(w) 1.60mm +0.30,-0.20mm thickness(t) 1.60mm +0.30,-0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 1.00mm min. recommended land pattern (pa) 2.10mm to 2.50mm(flow soldering) 2.00mm to 2.40mm(re?ow soldering) recommended land pattern (pb) 1.10mm to 1.30mm(flow soldering) 1.00mm to 1.20mm(re?ow soldering) recommended land pattern (pc) 1.00mm to 1.30mm(flow soldering) 1.10mm to 1.60mm(re?ow soldering) electrical characteristics capacitance 22f 20% rated voltage 6.3vdc temperature characteristic x7r(15%) dissipation factor (max.) 10% insulation resistance (min.) 4m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 20, 2017 (gmt) CGA5L1X7R0J226M160AE characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance CGA5L1X7R0J226M160AE esr CGA5L1X7R0J226M160AE capacitance CGA5L1X7R0J226M160AE dc bias characteristic CGA5L1X7R0J226M160AE temperature characteristic CGA5L1X7R0J226M160AE(no bias) CGA5L1X7R0J226M160AE(dc bias = 3.15v) ripple temperature rising CGA5L1X7R0J226M160AE(100khz) CGA5L1X7R0J226M160AE(500khz) CGA5L1X7R0J226M160AE(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 20, 2017 (gmt) CGA5L1X7R0J226M160AE associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.


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